ELECTROLYTIC NICKEL / GOLD PLATING PROCESS
Introduces products using advanced surface treatment technology of MK Chem & Tech
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TEMPERESIST Series
The TEMPERESIST series is used for high purity gold deposition for semiconductors with a purity of 99.99%. The deposited film exhibits excellent hardness (60-80HV) for wire bonding and excellent stability at high temperatures. In addition, the plating solution can be used for a long time using JPR 2001, a resin for removing metal impurities.
| Brand name |
Au(g/Lt) |
Temp(℃) |
Current density |
Hardness |
Features |
| Temperesist - EX |
6 ~ 20 |
65 ~ 80 |
0.1 ~ 0.4 ASD |
60 ~ 80 HV |
Soft gold product for general Au bonding. Proven results for BGA and CSP |
| Temperesist - FX |
4 ~ 8 |
60 ~ 70 |
0.2 ~ 1.0 ASD |
60 ~ 80 HV |
High-speed plating formulation. Directly applicable to Cu surfaces. Proven results for FPC |
| Temperesist - GR |
4 ~ 8 |
60 ~ 70 |
0.1 ~ 0.4 ASD |
60 ~ 80 HV |
Non-erosive to resist. Coreless PCBs |
| Temperesist - DX |
6 ~ 12 |
65 ~ 80 |
0.1 ~ 0.4 ASD |
60 ~ 80 HV |
The best solder joint bond strength |
| Temperesist - EX3000 |
8 ~ 15 |
40 ~ 60 |
0.5 ~ 1.0 ASD |
60 ~ 80 HV |
For bump plating on wafer |
| Temperesist - K-91H |
8 ~ 12 |
60 ~ 68 |
0.2 ~ 0.6 ASD |
70 ~ 90 HV |
Low stress gold coating. For bump plating on wafer (Cyanide free) |
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Surface morphology of Temperesist series (gold films on the copper)
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OROBRIGHT Series
The OROBRIGHT series is an Au-Co alloy plating solution of excellent throwing power and abrasion resistance. It is suitable for the products such as connector, memory module and NAND Flash memory because of excellent anti-corrosion and low contact resistance
| Brand name |
Au(g/Lt) |
Temp(℃) |
Current Density |
Hardness |
Features |
| Orobrignt - HS2 |
2 ~ 6 |
38 ~ 50 |
0.3 ~ 3.0 ASD |
180 ~ 210 HV |
Au-Co alloy. High throwing power. Rack plating |
| Orobrignt - HS2J |
2 ~ 8 |
38 ~ 50 |
0.5 ~ 5.0 ASD |
180 ~ 210 HV |
High deposition rate . Rack plating |
| Orobrignt - HS5 |
4 ~ 12 |
38 ~ 60 |
5.0 ~ 20 ASD |
180 ~ 210 HV |
Au-Co alloy. Submerged jet plating and jet plating |
| Orobrignt - BAR7 |
8 ~ 15 |
50 ~ 65 |
10 ~ 50 ASD |
160 ~ 200 HV |
Au-Co alloy. Jet plating with Ni barrier |
| Orobrignt - SA |
8 ~ 12 |
55 ~ 65 |
0.2 ~ 0.5 ASD |
120 ~ 160 HV |
Hard gold plating solution available Au Bonding |
