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ELECTROLYTIC COPPER PLATING PROCESS

Introduces products using advanced surface treatment technology of MK Chem & Tech

  • For PTH

    Brand Details Features
    TOP LUCINA SF TOP LUCINA SF BASE WR 2.5ml/L Excellent for flexible board. Offer uniform deposition without
    internal stress and provide excellent throwing power.
    TOP LUCINA SF-B 1ml/L
    TOP LUCINA SF-LEVELLER 5ml/L
    CURRENT DENSITY 3ASD
    TOP LUCINA LS TOP LUCINA MAKE-UP 5ml/L Provide low internal stress deposition.
    Suitable for flexible boards or others which concerns about the dimension.
    TOP LUCINA LS-A 2.5ml/L
    TOP LUCINA LS-B 1.0ml/L
    CURRENT DENSITY 2.5ASD
  • For Via Fill

    Brand Details Features
    TOP LUCINA BVF TOP LUCINA BVF BASE 5ml/L Additive for exclusively via-filling plating.
    Excellent via-filling effect and filling to large diameter via-holes is possible
    TOP LUCINA BVF-2 1.5ml/L
    TOP LUCINA BVF-LEVELLER 0.5ml/L
    CURRENT DENSITY 2ASD
    TOP LUCINA α TOP LUCINA α-M 4.5ml/L Additive for via-filling applicable to through-holes and pattern plating.
    Less formation of void and applicable to via-holes for 30 to 130 µm
    TOP LUCINA α-2 1ml/L
    TOP LUCINA α-3 3ml/L
    CURRENT DENSITY 1ASD
    TOP LUCINA FA TOP LUCINA FA-1 5ml/L Additive applicable to via-filling plating using insoluble anodes.
    Excellent filling effect and less decrease in filling effect
    TOP LUCINA FA-2 0.4ml/L
    TOP LUCINA FA-3 4ml/L
    CURRENT DENSITY 1.5ASD
    TOP LUCINA NSV TOP LUCINA NSV-1 4ml/L Additive applicable to high throwing bath. Excellent throwing power and
    suitable for application to package substrate having fine pattern
    TOP LUCINA NSV-2 0.5ml/L
    TOP LUCINA NSV-3 1ml/L
    CURRENT DENSITY 1ASD
    TOP LUCINA RF TOP LUCINA RF 0.5ml/L Refreshing agent to solve deterioration of via-filling bath. As will not remain in the bath,
    remedy in a short period is possible
    TOP LUCINA RF-CLF TOP LUCINA RF-CLF 30ml/L Non-chlorine type refreshing agent. Suitable for application to Top Lucina NSV bath
    which has extremely low concentration of chlorine ion
    TOP LUCINA HG TOP LUCINA HG 5ml/L Additive to accelerate dissolution of mono-valent copper.
    Reduce anode sludge and enhance stability of filling effect.

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