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- Development -

The top company that
contributes to the
development of electronics,
electric industry
with better value
and higher trust

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OSP Process

Introduces products using advanced surface treatment technology of MK Chem & Tech

  • OSP Process

    GLICOAT-SMD
    K1 F2(LX) F2(LX)PK
    Treatment Temp / Time 40℃/60~90sec 40℃/60~90sec 40℃/60~90sec
    Appearance (Liquid) Yellow, Transparent Yellow, Transparent Yellow, Transparent
    Imidazole Aryl phenylimidazole Aryl phenylimidazole Aryl phenylimidazole
    Heat Stability about 350℃ about 350℃ about 350℃
    Heat Resistance Reflow heating O O
    Film O
    Pb-Free O O O
    Selective gold
    compatibility
    O O O
    Cu2+ ion X X X
    Application Selective gold
    Metal Board and etc
    Selective gold
    Build-up board and lead-free solder
    Package
    (BGA, FC-BGA)
  • Upgrading imidazole for heat resistance enhancement

    1st generation 2nd generation 3rd generation
    Imidazole Alkyl imidazole Alkyl Benzimidazole Aryl phenylimidazole
    Pyrolysis temperature 150 ℃ 250 ℃ 350 ℃

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