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OSP Process
Introduces products using advanced surface treatment technology of MK Chem & Tech
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OSP Process
GLICOAT-SMD K1 F2(LX) F2(LX)PK Treatment Temp / Time 40℃/60~90sec 40℃/60~90sec 40℃/60~90sec Appearance (Liquid) Yellow, Transparent Yellow, Transparent Yellow, Transparent Imidazole Aryl phenylimidazole Aryl phenylimidazole Aryl phenylimidazole Heat Stability about 350℃ about 350℃ about 350℃ Heat Resistance Reflow heating O O △ Film △ △ O Pb-Free O O O Selective gold
compatibilityO O O Cu2+ ion X X X Application Selective gold
Metal Board and etcSelective gold
Build-up board and lead-free solderPackage
(BGA, FC-BGA) -
Upgrading imidazole for heat resistance enhancement
1st generation 2nd generation 3rd generation Imidazole Alkyl imidazole Alkyl Benzimidazole Aryl phenylimidazole Pyrolysis temperature 150 ℃ 250 ℃ 350 ℃ -