Soft Etching & Desmear

Introduces products using advanced surface treatment technology of MK Chem & Tech

• Micro etchant for copper

  	Brand Name	Features
  Sulfuric acid-hydrogen peroxide series	MKS-1200	Applicable to general purpose soft etching agent, D/F, LPR, PSR, Jet polishing pretreatment
  	MKS-1500	Available Half Etching uniformly
  	MKS-2000	Applicable to D/F, LPR, PSR pretreatment for fine pattern
  	GB-1400	Galvanic effect minimizes over-etching. Suitable for OSP process
  Potassium persulfate series	Oxone PS-16	Etchant of Potassium Monopersulfate series
  	ZA300 HS	Etchant of Potassium Monopersulfate series, Liquid type

• Base Copper	MKS-1200	MKS-2000

• Desmear

  Process	Brand name	Temerature	Time	Features
  Sweller	MK-600S	35 ~ 45 ℃	4 ~ 6 min	A treatment agent which swells the epoxy smear generated in the drilling process
  Desmear	MK-601D	70 ~ 80 ℃	6 ~ 8 min	Etching the resin only without effecting copper surface
  Neutralizer	MK-602N	40 ~ 50 ℃	4 ~ 6 min	Neutralize a manganate and remove